Nathan Schneck, NDSU Center for Nanoscale Science and Engineering (CNSE) research engineer, presented a research paper at the 2009 Electronic Components and Technology Conference, May 26-29, in San Diego. The paper, “Underfill Optimization Under Accelerated Temperature Cycling and Drop-Impact Loading for Stacked Packages Using Finite Element Modeling,” co-written by CNSE package design engineer Zane Johnson, was presented during the technical program at the conference.
Jason Thomas, NDSU undergraduate research assistant for CNSE, also presented a poster at the conference. His work, “A Unique Application of Decapsulation Combining Laser and Plasma,” was based on electronics packaging research conducted at the center involving a group of researchers including Jacob Baer, Philip Westby, Kevin Mattson, Frederik Haring, Greg Strommen, John Jacobson, Syed Sajid Ahmad and Aaron Reinholz.
Schneck earned a bachelor’s degree in mechanical engineering in 2005 and his master’s degree in mechanical engineering in 2008 from NDSU. Thomas is pursuing a bachelor’s degree in industrial engineering at NDSU.
Both presentations discussed research being conducted at CNSE in the area of advanced microelectronics modeling and testing. The Electronic Components and Technology Conference Technical Program contained presentations covering leading edge developments and technical innovations across the packaging spectrum topics including advanced packaging, modeling and simulation, optoelectronics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and radio frequency and emerging technologies.
For more information on Electronic Components and Technology Conference 2009, visit www.ectc.net/index.cfm.