Kevin Mattson, NDSU Center for Nanoscale Science and Engineering (CNSE) fabrication technician, presented a research paper at the 2009 American Society of Mechanical Engineers/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of Micro-Electro-Mechanical Systems, Nano-Electro-Mechanical Systems and Electronic Systems, also known as InterPACK, July 19-23, in San Francisco.
The paper, titled “Electroless Nickel Plating Process Optimization for Aluminum Terminals,” was based on a research process being developed at CNSE. Mattson says most computer chips come with aluminum terminals that are not solderable to attach to printed circuits to make electronic systems. Electroless nickel plating makes aluminum terminals solderable. This process expands research and prototyping capabilities of the electronics group at CNSE. The paper was co-written by Philip Westby, Fred Haring, Jacob Baer, Matt Steele, Syed Sajid Ahmad and Aaron Reinholz.
The InterPACK 2009 Conference promoted international cooperation, understanding, and promotion of efforts and disciplines in microelectronics, photonics, microwave, micro-electro-mechanical systems, nano-electro-mechanical systems - systems packaging and integration. The technical program offered presentations related to telecommunications; package technology; electrical design; simulation and testing; microelectronic systems; photonics; airborne, space and defense electronic systems; and micro-electro-mechanical systems and nanoscale phenomena in electronics. For more information on InterPACK 2009, visit www.interpackconference.org.