Syed Ahmad, manager of engineering services, Fred Haring, fabrication technician, and Bernd Scholz, research engineer, at NDSU’s Center for Nanoscale Science and Engineering (CNSE) presented nine papers at the 2010 International Microelectronics and Packaging Society, (IMAPS) 43rd International Symposium on Microelectronics, Nov. 2 to 4, in Raleigh, N.C.
NDSU presentations at the conference included: Characterization of Substrate Materials for Use in Environment Classification; Tape-Peel Testing as a Simple Method to Evaluate the Adhesion of Coated Layers on Metal Core PCB Package Reliability Testing; Spin Coating of Dielectrics on Thin Silicon Wafers to Enhance Strength Characteristics/Wafer Level/CSP Packaging Requirements; Micromachining of Sapphire Wafers using 532 nm Laser; Emerging Technologies High Via Density on Thin Metal Core PCB Using Electro Coated Dielectric High Performance Interconnects and Boards; A Novel Metal Core Substrate with Simplified Manufacturing Process and High Adhesion Conformal Dielectric and Circuitry Metal for High Density Chip-Scale Packaging Applications High Performance Interconnects and Boards; Correlation of Dispense Characteristics to Material Properties Printed and 3D Structural Electronics; Fine Feature Solder Paste Printing for Solder Sphere and Solder Trace Manufacturing Flip-Chip and Wafer Bumping: Processes and Reliability; Fabrication of Tall Structures for Microelectronic Applications Using Selective Electrodeposition Process Printed and 3D Structural Electronics.
Authors of these papers include: Syed Ahmad, Arun Shankaran, Fred Haring, Bernd Scholz, Aaron Reinholz, Ismir Pekmic, Nathan Schneck, Kaycie Gerstner, Nicole Dallman, Chris Hoffarth, Justin Vignes, John Jacobson, Zane Johnson, Kevin Mattson, Greg Strommen, Kristi Jean, Wei Yang Lim and Ferdous Sarwar.
The IMAPS conference promotes international cooperation, understanding and promotion of efforts and disciplines in microelectronics packaging and design, 3D packaging, thermal management, lead free issues, MEMS packaging, reliability testing, bio-med and advanced electronics materials and technologies.